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Combinatorial fabrication and high-throughput characterization of a Ti-Ni-Cu shape memory thin film composition spread
Combinatorial fabrication and high-throughput characterization of a Ti-Ni-Cu shape memory thin film composition spread
Combinatorial fabrication and high-throughput characterization of a Ti-Ni-Cu shape memory thin film composition spread
Lobel, R. (Autor:in) / Thienhaus, S. (Autor:in) / Savan, A. (Autor:in) / Ludwig, A. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 481-482 ; 151-155
01.01.2008
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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