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Combinatorial fabrication and high-throughput characterization of a Ti-Ni-Cu shape memory thin film composition spread
Combinatorial fabrication and high-throughput characterization of a Ti-Ni-Cu shape memory thin film composition spread
Combinatorial fabrication and high-throughput characterization of a Ti-Ni-Cu shape memory thin film composition spread
Lobel, R. (author) / Thienhaus, S. (author) / Savan, A. (author) / Ludwig, A. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 481-482 ; 151-155
2008-01-01
5 pages
Article (Journal)
English
DDC:
620.11
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