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Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition
Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition
Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition
Nishimoto, S. (Autor:in) / Kubo, A. (Autor:in) / Zhang, X. (Autor:in) / Liu, Z. (Autor:in) / Taneichi, N. (Autor:in) / Okui, T. (Autor:in) / Murakami, T. (Autor:in) / Komine, T. (Autor:in) / Fujishima, A. (Autor:in)
APPLIED SURFACE SCIENCE ; 254 ; 5891-5894
01.01.2008
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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