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Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition
Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition
Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition
Nishimoto, S. (author) / Kubo, A. (author) / Zhang, X. (author) / Liu, Z. (author) / Taneichi, N. (author) / Okui, T. (author) / Murakami, T. (author) / Komine, T. (author) / Fujishima, A. (author)
APPLIED SURFACE SCIENCE ; 254 ; 5891-5894
2008-01-01
4 pages
Article (Journal)
English
DDC:
621.35
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