Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process: Fid-Bau Portal

Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Lee, S.H. / Kim, S.S. / Han, S.Z. / Lim, C.Y.

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Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Lee, S.H. / Kim, S.S. / Han, S.Z. / Lim, C.Y.

Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Lee, S.H. / Kim, S.S. / Han, S.Z. / Lim, C.Y.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Ähnliche Titel

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Titel:

Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Beteiligte:

Lee, S.H. (Autor:in) / Kim, S.S. (Autor:in) / Han, S.Z. (Autor:in) / Lim, C.Y. (Autor:in) / Lee, C. / Lee, J.-B. / Park, D.-H. / Na, S.-J.

Erschienen in:

Advanced Welding and Micro Joining / Packaging for the 21st Century ; 71-74

MATERIALS SCIENCE FORUM ; 580/582

Erscheinungsdatum:

01.01.2008

Format / Umfang:

4 pages

ISSN:

0255-5476

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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