Microstructural evolution, mechanical properties, and strain hardening behavior of ultrafine grained commercial pure copper during the accumulative roll bonding process

Fattah-alhosseini, A. / Imantalab, O. / Mazaheri, Y. et al. | British Library Online Contents | 2016

Microstructural evolution, mechanical properties, and strain hardening behavior of ultrafine grained commercial pure copper during the accumulative roll bonding process

Fattah-alhosseini, A. / Imantalab, O. / Mazaheri, Y. et al. | British Library Online Contents | 2016

Microstructural Evolution and Mechanical Properties of Ultrafine Grained Commercially Pure 1100 Aluminum Alloy Processed by Accumulative Roll-Bonding (ARB)

Kim, Y. S. / Lee, T. O. / Shin, D. H. | British Library Online Contents | 2004

Grain Boundary Structure of Ultrafine Grained Pure Copper Fabricated by Accumulative Roll Bonding

Ikeda, K.-i. / Yamada, K. / Takata, N. et al. | British Library Online Contents | 2008

Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Lee, S.H. / Kim, S.S. / Han, S.Z. et al. | British Library Online Contents | 2008