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Nanoindentation hardness, Young's modulus, and creep behavior of organic-inorganic silica-based sol-gel thin films on copper
Nanoindentation hardness, Young's modulus, and creep behavior of organic-inorganic silica-based sol-gel thin films on copper
Nanoindentation hardness, Young's modulus, and creep behavior of organic-inorganic silica-based sol-gel thin films on copper
Latella, B.A. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 2357-2397
01.01.2008
41 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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