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Mechanical and Thermal Properties of Polymer Composites for Electronic Packaging Application
Mechanical and Thermal Properties of Polymer Composites for Electronic Packaging Application
Mechanical and Thermal Properties of Polymer Composites for Electronic Packaging Application
Rashid, E.S.A. (Autor:in) / Ariffin, K. (Autor:in) / Akil, H.M. (Autor:in) / Kooi, C.C. (Autor:in)
JOURNAL OF REINFORCED PLASTICS AND COMPOSITES ; 27 ; 1573-1584
01.01.2008
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1923
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