Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application
Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application
Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application
Fang, Haoming (Autor:in) / Bai, Shu-Lin (Autor:in) / Wong, Ching Ping (Autor:in)
Composites.Part A, Applied science and manufacturing ; 100 ; 71-80
01.01.2017
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11805
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