Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Copper Electroplating via Direct - Current and Alternating Current Overlaying Technology
Copper Electroplating via Direct - Current and Alternating Current Overlaying Technology
Copper Electroplating via Direct - Current and Alternating Current Overlaying Technology
Wang, X.-l. (Autor:in) / Li, D.-g. (Autor:in)
MATERIALS PROTECTION -WUHAN- ; 41 ; 37-38
01.01.2008
2 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
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