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ToF-SIMS imaging of Cl at Cu grain boundaries in interconnects for microelectronics
ToF-SIMS imaging of Cl at Cu grain boundaries in interconnects for microelectronics
ToF-SIMS imaging of Cl at Cu grain boundaries in interconnects for microelectronics
Barnes, J. P. (Autor:in) / Carreau, V. (Autor:in) / Maitrejean, S. (Autor:in)
APPLIED SURFACE SCIENCE ; 255 ; 1564-1568
01.01.2008
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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