Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
First-Principles Study of the Stability and Interfacial Bonding of Tilt and Twist Grain Boundaries in Al and Cu
First-Principles Study of the Stability and Interfacial Bonding of Tilt and Twist Grain Boundaries in Al and Cu
First-Principles Study of the Stability and Interfacial Bonding of Tilt and Twist Grain Boundaries in Al and Cu
Wang, R.-Z. (Autor:in) / Kohyama, M. (Autor:in) / Tanaka, S. (Autor:in) / Tamura, T. (Autor:in) / Ishibashi, S. (Autor:in)
01.01.2009
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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