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First-Principles Study of the Stability and Interfacial Bonding of Tilt and Twist Grain Boundaries in Al and Cu
First-Principles Study of the Stability and Interfacial Bonding of Tilt and Twist Grain Boundaries in Al and Cu
First-Principles Study of the Stability and Interfacial Bonding of Tilt and Twist Grain Boundaries in Al and Cu
Wang, R.-Z. (author) / Kohyama, M. (author) / Tanaka, S. (author) / Tamura, T. (author) / Ishibashi, S. (author)
2009-01-01
8 pages
Article (Journal)
English
DDC:
620.11
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