Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5

Mu, D. / Huang, H. / Nogita, K. | British Library Online Contents | 2012

Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes

Mu, D. / Huang, H. / McDonald, S. D. et al. | British Library Online Contents | 2013

Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer

Wu, Yi-Hsin / Yu, Chi-Yang / Ho, Cheng-Ying et al. | British Library Online Contents | 2013

Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer

Wu, Y. H. / Yu, C. Y. / Ho, C. Y. et al. | British Library Online Contents | 2013

The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

Tseng, C. F. / Duh, J. G. | British Library Online Contents | 2013