Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer
Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer
Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer
Wu, Y. H. (Autor:in) / Yu, C. Y. (Autor:in) / Ho, C. Y. (Autor:in) / Duh, J. G. (Autor:in)
MATERIALS LETTERS ; 105 ; 40-42
01.01.2013
3 pages
Aufsatz (Zeitschrift)
Englisch
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