Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
Chiu, T. C. (Autor:in) / Lin, H. C. (Autor:in)
INTERNATIONAL JOURNAL OF FRACTURE ; 156 ; 75-96
01.01.2009
22 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1126
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