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Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
Chiu, T. C. (author) / Lin, H. C. (author)
INTERNATIONAL JOURNAL OF FRACTURE ; 156 ; 75-96
2009-01-01
22 pages
Article (Journal)
English
DDC:
620.1126
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