Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
An Overview of Flip Chip Joining Technologies and the Materials Involved
An Overview of Flip Chip Joining Technologies and the Materials Involved
An Overview of Flip Chip Joining Technologies and the Materials Involved
Norlyng, S. (Autor:in)
ADVANCING MICROELECTRONICS ; 36 ; 12-19
01.01.2009
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.381
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