Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Flip Chip Technologies and Their Applications in MEMS Packaging
Flip Chip Technologies and Their Applications in MEMS Packaging
Flip Chip Technologies and Their Applications in MEMS Packaging
Wang, H.-Y. (Autor:in)
01.01.2002
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
515.355
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Measurement of Pressure Distribution during MEMS and Flip Chip Encapsulation
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