Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Transient thermal stress intensity factors of bimaterial interface cracks using refined three-fringe photoelasticity
Transient thermal stress intensity factors of bimaterial interface cracks using refined three-fringe photoelasticity
Transient thermal stress intensity factors of bimaterial interface cracks using refined three-fringe photoelasticity
Simon, B.N. (Autor:in) / Prasath, R.G.R. (Autor:in) / Ramesh, K. (Autor:in)
JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN ; 44 ; 427-438
01.01.2009
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
624.176
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