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A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate

Liang, Z. / Wu, Y.B. / Wang, X.B. / Peng, Y. / Xu, W. / Zhao, W.X.

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A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate

Liang, Z. / Wu, Y.B. / Wang, X.B. / Peng, Y. / Xu, W. / Zhao, W.X.

A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate

Liang, Z. / Wu, Y.B. / Wang, X.B. / Peng, Y. / Xu, W. / Zhao, W.X.

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Titel:

A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate

Beteiligte:

Liang, Z. (Autor:in) / Wu, Y.B. (Autor:in) / Wang, X.B. (Autor:in) / Peng, Y. (Autor:in) / Xu, W. (Autor:in) / Zhao, W.X. (Autor:in) / Guo, D. / Wang, J. / Jia, Z. / Kang, R.

Erschienen in:

Advances in Materials Manufacturing Science and Technology XIII Volume I Advanced Manufacturing Technology and Equipment, and Manufacturing Systems and Automation ; 35-40

MATERIALS SCIENCE FORUM ; 626/627

Erscheinungsdatum:

01.01.2009

Format / Umfang:

6 pages

ISSN:

0255-5476

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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Nomura, M. / Wu, Y.B. / Kuriyagawa, T. et al. | British Library Online Contents | 2009

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Cao, J.G. / Wu, Y.B. / Guo, H.R. et al. | British Library Online Contents | 2012

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