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A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate

Liang, Z. / Wu, Y.B. / Wang, X.B. / Peng, Y. / Xu, W. / Zhao, W.X.

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A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate

Liang, Z. / Wu, Y.B. / Wang, X.B. / Peng, Y. / Xu, W. / Zhao, W.X.

A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate

Liang, Z. / Wu, Y.B. / Wang, X.B. / Peng, Y. / Xu, W. / Zhao, W.X.

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Title:

A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate

Contributors:

Liang, Z. (author) / Wu, Y.B. (author) / Wang, X.B. (author) / Peng, Y. (author) / Xu, W. (author) / Zhao, W.X. (author) / Guo, D. / Wang, J. / Jia, Z. / Kang, R.

Published in:

Advances in Materials Manufacturing Science and Technology XIII Volume I Advanced Manufacturing Technology and Equipment, and Manufacturing Systems and Automation ; 35-40

MATERIALS SCIENCE FORUM ; 626/627

Publication date:

2009-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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