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Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate
Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate
Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate
Tsai, M.H. (Autor:in) / Lin, Y.W. (Autor:in) / Chuang, H.Y. (Autor:in) / Kao, C.R. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 24 ; 3407-3411
01.01.2009
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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