Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate: Fid-Bau Portal

Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate

Tsai, M.H. / Lin, Y.W. / Chuang, H.Y. / Kao, C.R.

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Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate

Tsai, M.H. / Lin, Y.W. / Chuang, H.Y. / Kao, C.R.

Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate

Tsai, M.H. / Lin, Y.W. / Chuang, H.Y. / Kao, C.R.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate

Contributors:

Tsai, M.H. (author) / Lin, Y.W. (author) / Chuang, H.Y. (author) / Kao, C.R. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 24 ; 3407-3411

Publication date:

2009-01-01

Size:

5 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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