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Molecular Self - Assembly Combined with Electroless Copper Plating of Laser - Induced Patterning on Polyimide Film
Molecular Self - Assembly Combined with Electroless Copper Plating of Laser - Induced Patterning on Polyimide Film
Molecular Self - Assembly Combined with Electroless Copper Plating of Laser - Induced Patterning on Polyimide Film
Chen, D.-s. (Autor:in) / Lu, Q.-h. (Autor:in)
MATERIALS PROTECTION -WUHAN- ; 42 ; 1-4
01.01.2009
4 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
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