Non-uniform Stress Field and Stress Concentration Induced by Grain Boundary and Triple Junction of Tricrystal

Wan, J. / Yue, Z. | British Library Online Contents | 2003

Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal

Andiarwanto, S. / Miura, H. / Sakai, T. | British Library Online Contents | 2002

Finite element analysis about effects of stiffness distribution on stresses and elastic strain energy near the triple junction in a tricrystal

Chen, C. R. / Li, S. X. / Wen, J. L. et al. | British Library Online Contents | 2000

Grain Boundary Triple Junction Effects on the Fatigue Deformation and Cracking Behaviros of Copper Tricrystal and Tetracrystals

Jia, W. / Zhu, Z. / Wang, Z. et al. | British Library Online Contents | 2002

On the design of controlled tricrystal specimens for the systematic investigation of static grain boundary triple junction properties

KREMER, R. / Narayanan, R. / Shekhar, S. et al. | British Library Online Contents | 2005