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Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal
Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal
Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal
Andiarwanto, S. (Autor:in) / Miura, H. (Autor:in) / Sakai, T. (Autor:in) / Lee, D. N.
01.01.2002
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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