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Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper
Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper
Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper
Koyama, S. (Autor:in) / Aoki, Y. (Autor:in) / Shohji, I. (Autor:in)
MATERIALS TRANSACTIONS ; 51 ; 1759-1763
01.01.2010
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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