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    Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper

    New search for: Koyama, S.
    New search for: Aoki, Y.
    New search for: Shohji, I.

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    Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper

    New search for: Koyama, S.
    New search for: Aoki, Y.
    New search for: Shohji, I.

    Access

    Access via TIB
    Check availability in my library
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    Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper

    New search for: Koyama, S.
    New search for: Aoki, Y.
    New search for: Shohji, I.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
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    Document information
    Title:

    Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper

    Contributors:

    Koyama, S. (author) / Aoki, Y. (author) / Shohji, I. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 51 ; 1759-1763

    Publication date:

    2010-01-01

    Size:

    5 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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