Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

Yang, P. F. / Lai, Y. S. / Jian, S. R. et al. | British Library Online Contents | 2008

Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures

Chiu, Wei-Lan / Liu, Chien-Min / Haung, Yi-Sa et al. | British Library Online Contents | 2016

Study of Cu6Sn5 and Cu3Sn growth behaviors by considering trace Zn

Yu, C. / Wang, D. / Chen, J. et al. | British Library Online Contents | 2014

Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures

Chiu, Wei-Lan / Liu, Chien-Min / Haung, Yi-Sa et al. | British Library Online Contents | 2016

Formation of bulk Cu6Sn5 intermetallic compounds in Sn–Cu lead-free solders during solidification

Shen, J. / Liu, Y. C. / Gao, H. X. | British Library Online Contents | 2007