Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
A Novel Process with Highly Dispersive Ability for Bright Acid Copper Plating
A Novel Process with Highly Dispersive Ability for Bright Acid Copper Plating
A Novel Process with Highly Dispersive Ability for Bright Acid Copper Plating
Xiao, F.-x. (Autor:in) / Wei, Y.-j. (Autor:in) / Wang, D.-s. (Autor:in) / Li, B. (Autor:in) / Ma, L.-l. (Autor:in)
CORROSION SCIENCE AND PROTECTION TECHNOLOGY ; 23 ; 175-178
01.01.2011
4 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11223
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