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A Novel Process with Highly Dispersive Ability for Bright Acid Copper Plating
A Novel Process with Highly Dispersive Ability for Bright Acid Copper Plating
A Novel Process with Highly Dispersive Ability for Bright Acid Copper Plating
Xiao, F.-x. (author) / Wei, Y.-j. (author) / Wang, D.-s. (author) / Li, B. (author) / Ma, L.-l. (author)
CORROSION SCIENCE AND PROTECTION TECHNOLOGY ; 23 ; 175-178
2011-01-01
4 pages
Article (Journal)
Unknown
DDC:
620.11223
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