Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
On the root cause of Kirkendall voiding in Cu~3Sn
On the root cause of Kirkendall voiding in Cu~3Sn
On the root cause of Kirkendall voiding in Cu~3Sn
Yin, L. (Autor:in) / Borgesen, P. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 455-466
01.01.2011
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints
| British Library Online Contents | 2010
Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints
| British Library Online Contents | 2014
| NTIS | 1968
Strain-induced Kirkendall mixing at semiconductor interfaces
| British Library Online Contents | 2000
Kirkendall porosity during thermal treatment of Mo-Cu nanomultilayers
| British Library Online Contents | 2007