Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives
Effect of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives
Effect of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives
Gao, H. (Autor:in) / Liu, L. (Autor:in) / Luo, Y. f. (Autor:in) / Jia, D. m. (Autor:in) / Wang, F. (Autor:in) / Liu, K. h. (Autor:in)
INTERNATIONAL JOURNAL OF POLYMERIC MATERIALS ; 60 ; 409-427
01.01.2011
19 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.192
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