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Effect of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives
Effect of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives
Effect of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives
Gao, H. (author) / Liu, L. (author) / Luo, Y. f. (author) / Jia, D. m. (author) / Wang, F. (author) / Liu, K. h. (author)
INTERNATIONAL JOURNAL OF POLYMERIC MATERIALS ; 60 ; 409-427
2011-01-01
19 pages
Article (Journal)
English
DDC:
620.192
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