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Influence of Formaldehyde and Emulsifier OP on Semi - Bright Tin Plating of Printed Circuit Board in Acidic Bath
Influence of Formaldehyde and Emulsifier OP on Semi - Bright Tin Plating of Printed Circuit Board in Acidic Bath
Influence of Formaldehyde and Emulsifier OP on Semi - Bright Tin Plating of Printed Circuit Board in Acidic Bath
Xiao, F.-x. (Autor:in) / Wei, Y.-j. (Autor:in) / Li, F.-f. (Autor:in) / Zhao, X.-c. (Autor:in) / Liu, T. (Autor:in)
MATERIALS PROTECTION -WUHAN- ; 44 ; 01-05
01.01.2011
5 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
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