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Influence of Formaldehyde and Emulsifier OP on Semi - Bright Tin Plating of Printed Circuit Board in Acidic Bath
Influence of Formaldehyde and Emulsifier OP on Semi - Bright Tin Plating of Printed Circuit Board in Acidic Bath
Influence of Formaldehyde and Emulsifier OP on Semi - Bright Tin Plating of Printed Circuit Board in Acidic Bath
Xiao, F.-x. (author) / Wei, Y.-j. (author) / Li, F.-f. (author) / Zhao, X.-c. (author) / Liu, T. (author)
MATERIALS PROTECTION -WUHAN- ; 44 ; 01-05
2011-01-01
5 pages
Article (Journal)
Unknown
DDC:
620.1
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