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Effects of triethanolamine and polyethylene glycol additives on electrodeposition of Sn-Ag solder alloy
Effects of triethanolamine and polyethylene glycol additives on electrodeposition of Sn-Ag solder alloy
Effects of triethanolamine and polyethylene glycol additives on electrodeposition of Sn-Ag solder alloy
Cho, J.-K. (Autor:in) / Kim, J.-H. (Autor:in) / Lim, J.-H. (Autor:in) / Lee, K.-H. (Autor:in) / Kang, S.-G. (Autor:in)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 27 ; 970-972
01.01.2011
3 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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