Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Study of size effect in micro-extrusion process of pure copper
Study of size effect in micro-extrusion process of pure copper
Study of size effect in micro-extrusion process of pure copper
Chan, W.L. (Autor:in) / Fu, M.W. (Autor:in) / Yang, B. (Autor:in)
MATERIALS AND DESIGN -REIGATE- ; 32 ; 3772-3782
01.01.2011
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.0042
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