Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
On the Origins, Status, and Future of Flip Chip and Wafer Level Packaging
On the Origins, Status, and Future of Flip Chip and Wafer Level Packaging
On the Origins, Status, and Future of Flip Chip and Wafer Level Packaging
Huffman, A. (Autor:in) / Garrou, P. (Autor:in)
ADVANCING MICROELECTRONICS ; 38 ; 10-17
01.01.2011
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.381
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