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Multiscale modeling of nanoindentation in copper thin films via the concurrent coupling of the meshless Hermite-Cloud method with molecular dynamics
Multiscale modeling of nanoindentation in copper thin films via the concurrent coupling of the meshless Hermite-Cloud method with molecular dynamics
Multiscale modeling of nanoindentation in copper thin films via the concurrent coupling of the meshless Hermite-Cloud method with molecular dynamics
Ng, T. Y. (Autor:in) / Pandurangan, V. (Autor:in) / Li, H. (Autor:in)
APPLIED SURFACE SCIENCE ; 257 ; 10613-10620
01.01.2011
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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