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    Multiscale modeling of nanoindentation in copper thin films via the concurrent coupling of the meshless Hermite-Cloud method with molecular dynamics

    New search for: Ng, T. Y.
    New search for: Pandurangan, V.
    New search for: Li, H.

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    Multiscale modeling of nanoindentation in copper thin films via the concurrent coupling of the meshless Hermite-Cloud method with molecular dynamics

    New search for: Ng, T. Y.
    New search for: Pandurangan, V.
    New search for: Li, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Multiscale modeling of nanoindentation in copper thin films via the concurrent coupling of the meshless Hermite-Cloud method with molecular dynamics

    New search for: Ng, T. Y.
    New search for: Pandurangan, V.
    New search for: Li, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Multiscale modeling of nanoindentation in copper thin films via the concurrent coupling of the meshless Hermite-Cloud method with molecular dynamics

    Contributors:

    Ng, T. Y. (author) / Pandurangan, V. (author) / Li, H. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 257 ; 10613-10620

    Publication date:

    2011-01-01

    Size:

    8 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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