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Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation

Young, N. / Johnson, J. / Ewsuk, K.G.

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Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation

Young, N. / Johnson, J. / Ewsuk, K.G.

Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation

Young, N. / Johnson, J. / Ewsuk, K.G.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Titel:

Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation

Beteiligte:

Young, N. (Autor:in) / Johnson, J. (Autor:in) / Ewsuk, K.G. (Autor:in) / Goto, T. / Cheng, Y.-B. / Akatsu, T.

Erschienen in:

Advanced Engineering Ceramics and Composites CSJ Series - Publications of the Ceramic Society of Japan Vol. 22 Key Engineering Materials Vol. 484 ISSN 1013-9826 Selected, peer reviewed papers from the 4^t^h International Symposium on Advanced Ceramics, Osaka International Convention Center, November 14-18, 2010, Japan ; 192-203

KEY ENGINEERING MATERIALS ; 484

Erscheinungsdatum:

01.01.2011

Format / Umfang:

12 pages

ISSN:

1013-9826

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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