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Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation
Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation
Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation
Young, N. (author) / Johnson, J. (author) / Ewsuk, K.G. (author) / Goto, T. / Cheng, Y.-B. / Akatsu, T.
2011-01-01
12 pages
Article (Journal)
English
DDC:
620.11
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