Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system-Computational simulation and experimental studies
Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system-Computational simulation and experimental studies
Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system-Computational simulation and experimental studies
Chen, L. (Autor:in) / Yeap, K.B. (Autor:in) / Zeng, K.Y. (Autor:in) / She, C.M. (Autor:in) / Liu, G.R. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 2511-2523
01.01.2011
13 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2009
|Indentation induced film fracture in hard film - soft substrate systems
British Library Online Contents | 2003
|Elastic anisotropy effect on indentation-induced thin film interfacial delamination
British Library Online Contents | 2008
|