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Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system-Computational simulation and experimental studies
Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system-Computational simulation and experimental studies
Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system-Computational simulation and experimental studies
Chen, L. (author) / Yeap, K.B. (author) / Zeng, K.Y. (author) / She, C.M. (author) / Liu, G.R. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 2511-2523
2011-01-01
13 pages
Article (Journal)
English
DDC:
620.11
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