Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Crack Detection in Full Size Cz-Silicon Wafers Using Lamb Wave Air Coupled Ultrasonic Testing (LAC-UT)
Crack Detection in Full Size Cz-Silicon Wafers Using Lamb Wave Air Coupled Ultrasonic Testing (LAC-UT)
Crack Detection in Full Size Cz-Silicon Wafers Using Lamb Wave Air Coupled Ultrasonic Testing (LAC-UT)
Chakrapani, S. K. (Autor:in) / Padiyar, M. J. (Autor:in) / Balasubramaniam, K. (Autor:in)
JOURNAL OF NONDESTRUCTIVE EVALUATION ; 31 ; 46-55
01.01.2012
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.1127
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