Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Recrystallisation and bonding behaviour of ultra fine grained copper and Cu-Cr-Zr alloy using ECAP
Recrystallisation and bonding behaviour of ultra fine grained copper and Cu-Cr-Zr alloy using ECAP
Recrystallisation and bonding behaviour of ultra fine grained copper and Cu-Cr-Zr alloy using ECAP
Jayakumar, P. K. (Autor:in) / Balasubramanian, K. (Autor:in) / Rabindranath Tagore, G. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 538 ; 7-13
01.01.2012
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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