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Recrystallisation and bonding behaviour of ultra fine grained copper and Cu-Cr-Zr alloy using ECAP
Recrystallisation and bonding behaviour of ultra fine grained copper and Cu-Cr-Zr alloy using ECAP
Recrystallisation and bonding behaviour of ultra fine grained copper and Cu-Cr-Zr alloy using ECAP
Jayakumar, P. K. (author) / Balasubramanian, K. (author) / Rabindranath Tagore, G. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 538 ; 7-13
2012-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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