Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Material removal mechanism of Cu-CMP studied by nano-scratching under various environmental conditions
Material removal mechanism of Cu-CMP studied by nano-scratching under various environmental conditions
Material removal mechanism of Cu-CMP studied by nano-scratching under various environmental conditions
Fu, W. E. (Autor:in) / Chen, C. C. (Autor:in) / Huang, K. W. (Autor:in) / Chang, Y. Q. (Autor:in)
WEAR -LAUSANNE- ; 278/279 ; 87-93
01.01.2012
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11292
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